AOI Inspection (Engl)

Trevor Galbraith talks to TRI's Steve Marks about TRI's One Stop Solution for PCBA test and inspection and how it can integrate with both TRI's YMS 4.0 yield management system and PanaCIM's factory automation software.

Trevor Galbraith talks to TRI's Sales Manager Tom Tu about TRI's newly released 3D SPI TR7700DI/QI Plus. Featured Product: 3D SPI TR7007Q Plus: https://www.tri.com.tw/en/product/product_detail-10-2-1592-1.html 3D SPI TR7007D Plus: https://www.tri.com.tw/en/product/product_detail-10-2-1593.html Credits: GlobalSMT Source: https://www.shorturl.at/tvJ34

The TR7700Q SII-S is built on a 2.5 μm high-resolution platform featuring 25 MP imaging technology designed for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852). Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. Features: • 2.5 μm High-Resolution 3D SEMI Back-end AOI • Precise Metrology-Grade Measurements* • AI-powered Inspection with AI Smart Programming* • Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions • Bond Inspection: ball bond, wedge bond, and ribbon bond • Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping* • Industry 4.0 Ready Platform *Optional See More: https://www.tri.com.tw/en/product/product_detail-70-2-1790-1.html